Digital News: CES 2008: Skype VoIP Application for Intel MID concept UMPCs
It looks like Skype is developing a VoIP application for the conceptional Intel MID (Mobile Internet Device) UMPC. The device runs on an open-source Linux OS, so when the application will be ready, we can expect phone functionality to be enabled on any other Linux-based UMPC.
Digital News: Western Digital's New 320GB 2.5" Laptop HDDs
Western Digital presents its new Scorpio 320GB hard drive for laptops. This 2.5" device is just 9.5mm thick and delivers excellent performance (3Gbps) while operating quietly and under cool temperatures. The drive also incorporates exclusive Western Digital Technologies, such as WhisperDrive, ShockGuard, and IntelliSeek. You can get it online at www.shopwd.com for $199.99.
Digital News: Appletell's Report on Apple OS X 10.5 Leopard
Appletell has compiled a report after their 72 hour experience with the new Apple OS X Leopard. Here's the overall, but we recommend you to read the full article:
"Overall, Leopard is an amazing OS and well worth the $129 price tag. If you’re a Mac user, definitely pick it up if you haven’t already, and if you’re a PC user - go buy a Mac! (or install Leopard on your SSE3 or higher CPU)."
Digital News: SanDisk8GB Memory Cards Now Available
SanDisk has officially released 8GB microSDHC and M2 flash memory cards, which are now available worldwide for around $149.99. The company says that memory cards are very important to satisfy the need for large memory capacities of today's mobile users. SanDisk in assotiation with event organizer Gorilla Union will hold a party on the Sunset Strip in Los Angeles to celebrate the launch.
Digital News: AU Optronics Designed Thinner Mobile LCDs
AU Optronics developed two ultra-thin mobile LCD panels that will go into mass production in 2008. The first is a 1.9" diagonal display measuring just 0.69mm thick and the second is a 4.3" multi-touch capable LCD screen measuring 2.2mm in thickness with a resolution of 480 x 272.
Intel, Microsoft,
HP, TI, NEC and NXP and several other companies are now working on
the third version of the USB standard, which should be ready by the
second half of 2008 and promises to be about 10 times faster than the
current USB 2.0.